Air Cooling Technology for Electronic Equipment / Edition 1

by Sung Jin Kim, Sang Woo Lee

Overview

Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics.

Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?

The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.

Product Details

ISBN-13:	9780849394478
Publisher:	Taylor & Francis
Publication date:	04/26/1996
Edition description:	New Edition
Pages:	260
Product dimensions:	6.12(w) x 9.19(h) x (d)

About the Author

Sung J. Kim and Sang W. Lee

Table of Contents

Geometric Optimization of Cooling Techniques, A. BejanIntroductionStack of Parallel Vertical Plates Cooled by Natural ConvectionBundle of Horizontal Cylinders (Pin Fins) Cooled by Natural ConvectionStack of Parallel Plates Cooled by Laminar Forced ConvectionStack of Parallel Plates With Flush-Mounted and Protruding Heat SourcesStack of Parallel Plates Cooled by Turbulent Forced ConvectionStack of Parallel Plates Immersed in a Free StreamBundle of Cylinders Cooled by Forced ConvectionHeat Generating Plate Cooled Inside a Parallel Plate ChannelStacks of Plates Shielded by Porous ScreensPlate Fins with Variable Thickness and HeightHeat Sinks with Pin Fins and Plate FinsConclusionEntrance Design Correlations for Circuit Boards in Forced-Air Cooling, M. Faghri, M. Molki, and Y. AsakoIntroductionA New Correlation for Pressure DropA Correlation for Heat Transfer and Wake EffectA User-Friendly Program for Prediction of Array TemperatureConclusionForced Air Cooling of Low-Profile Package Arrays, R.A. WirtzIntroductionArray GeometryConvection ProcessesEstimation of Package TemperatureDetermination of h (sub K) and qPackage Heat Transfer - Uniform, In-line ArraysCoolant Pressure Drop - Uniform, In-Line ArraysNon-Uniform ArraysConclusionConjugate Heat Transfer in Forced Air Cooling of Electronic Components, A. OrtegaIntroductionBackgroundClassification of ProblemsTwo Dimensional Situation: Strip Source of Heat in Boundary Layer and Channel FlowThree Dimensional Situations: Rectangular Source of HeatClosureEnhanced Air Cooling of Electronic Equipment, S.V. GarimellaIntroductionEnhancement StrategiesEnhancement TechniquesPerformance Evaluation CriteriaClosureLimits of Air Cooling - A Methodological Approach, K. AzarIntroductionThermal Phenomena in Electronic EnclosuresThermal Coupling in Electronic